HP 100g AG Thermal Paste - description
AG SILICONE PASTE HP 100G THERMAL PASTE HP necessary for the proper operation of all kinds of temperature sensors. Protects from weather influences, prevents punctures. It is characterized by very good chemical resistance to oxidation, the action of aqueous solutions, acids, salt bases, sulfur dioxide and ammonia. It has a wide operating temperature range. Application: Modules with high thermal conductivity
Cooling equipment on end plates or frames
Storage and high-speed drives
Motor management systems for the automotive industry
Hard disk and DVD drives
Power converters
High power LEDs
Network communication devices
Household appliances, electronic and electrical components
Heat transfer from the heat tube condenser to the exchanger in the vacuum solar collector Specification: Color: white Thermal conductivity: 1.5 W/mk Thermal impedance: 0.0227 °C in2/W Specific gravity: 2.1 g/cm3 Evaporation: 0.001 Leakage: 0.05 Dialectical constant: 5.0 Viscosity: does not flow Thixotropic index: 380+/-10 Temperature resistance: -50~340 °C Operating temperature: -30~300 °C Volume: 100g
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